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Wire saw Product List and Ranking from 7 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

Wire saw Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. ジャパンクリエイト Saitama//Testing, Analysis and Measurement
  3. 新興製作所 Osaka//Manufacturing and processing contract
  4. 4 フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
  5. 5 null/null

Wire saw Product ranking

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. What is a "cutting technology" single wire saw? 新興製作所
  2. 【Cutting Machine / Wire Saw】 ~For those struggling with material slicing~
  3. MH-1000 Multi-Wire Saw ジャパンクリエイト
  4. 4 Wire saw, high-purity α-type silicon carbide abrasive material for wrapping processing 'GC' フジミインコーポレーテッド
  5. 5 Tabletop Wire Saw "Single Wire Saw" [Made in Japan]

Wire saw Product List

1~15 item / All 29 items

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MH-1000 Multi-Wire Saw

● Down-cutting method using high-performance electroplated diamond wire ● No slurry required due to fixed abrasives

This device is designed to cut materials thinly and with high precision by utilizing precision machining technology. It uses a total of 5-axis AC servo motors, including wire-driven 2 axes, traverse 2 axes, and workpiece vertical 1 axis, and is a compact dedicated machine capable of cutting various materials such as quartz and ceramics.

  • Other semiconductor manufacturing equipment
  • Other processing machines

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Kanemoto Seiko Co., Ltd. Equipment Introduction

We will slice up to a maximum size of 1000mm x 1100mm!

Kanemoto Seiko Co., Ltd. specializes in cutting and processing quartz glass, silicon, and ceramics, particularly excelling in slicing large workpieces. With the introduction of ultra-large wire saws, we can slice workpieces up to 1100 mm × 1000 mm × 350 mm with a thickness tolerance of ±0.04 and flatness of 0.04 or less. Additionally, the introduction of ultra-large diamond saws allows for external processing and slicing of workpieces up to 1000 mm in height and 1000 mm in width. Our multi-blade saw can also slice workpieces measuring 400 mm × 400 mm × 400 mm to a thickness of over 10 mm. For more details, please contact us or refer to our catalog.

  • Processing Contract
  • Glass
  • Ceramics

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What is a "cutting technology" single wire saw?

Processing of large-diameter materials and thick plates, which are difficult to process with a multi-wire saw, is possible! This significantly reduces processing loss of expensive materials.

We also have single wire saws in addition to multi-wire saws. With the single wire saw, it is possible to process large diameter materials and thick plates that are difficult to process with multi-wire saws. By adopting a fixed abrasive method using diamond wire, we can significantly reduce processing loss of expensive materials. 【Main compatible materials】 Aluminum Nitride AlN / Alumina Al2O3 / Sapphire / Silicon Carbide SiC / Copper Cu / Molybdenum Mo / Tungsten W / Copper Molybdenum / Copper Tungsten / Quartz Glass / Lithium Niobate LiNbO3 / Lithium Tantalate LiTaO3 / Barium Titanate BaTiO3 / Zirconia ZrO2 / Silicon Nitride Si3N4 / Cemented Carbide / Ceramic Matrix Composites (CMC) / Crystalline materials (Si, SiC, GaN, etc.) *For more details, please download the PDF catalog or feel free to contact us.

  • Processing Contract
  • Wafer processing/polishing equipment
  • Circuit board processing machine

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Wire saw, high-purity α-type silicon carbide abrasive material for wrapping processing 'GC'

Resistant to chemicals, it self-generates sharp grinding edges through crushing, demonstrating excellent polishing power!

"GC" is a green silicon carbide abrasive material that boasts high SiC purity. The hexagonal α-type crystals possess hardness second only to diamond and are also very stable chemically at room temperature. Therefore, they are not affected by chemicals, self-generate sharp cutting edges through fragmentation, and exhibit excellent polishing power. It is used not only for precision lapping and dicing of quartz and ferrite, as well as for wire saws for cutting Si ingots, but also as a wide range of polishing materials for processing hard metals, cutting tools, soft metals such as cast iron and copper alloys, and resins. Additionally, it is suitable as a material for ultra-fine precision grinding wheels. 【Features】 ■ Has hardness second only to diamond ■ Very stable chemically at room temperature ■ Exhibits semiconductor properties electrically ■ Good thermal conductivity and high-temperature resistance ■ Also used as a material for heat sinks (heat dissipation components) *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials
  • others

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Metal Cutting Wire Saw 【*Free materials with proven results available】

Cutting of dissimilar metals and composite materials is possible! Suitable for large structures, building demolition, and large ship reduction projects. We assist in safe and efficient construction work.

At Mito Engineering, we propose cutting large structures using "metal cutting wire saws," as well as demolition methods and equipment design tailored to various on-site working environments, helping to ensure safer and more efficient construction work. 【Benefits】 ■ Low wire speed minimizes the risk to operators ■ Extended wire lifespan ■ Improved cutting efficiency We also have a track record of designing and manufacturing automated cutting devices operated remotely for large equipment demolition projects, including cutting low-pressure steam turbine rotors (cutting time: 305 minutes) and dissimilar metal composite materials of SUS304 + S25C (cutting time: 63 minutes). *For detailed specifications, please download the PDF. Feel free to contact us for more information.

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  • Plastic processing machines (cutting and rolling)

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Diamond Wire Cutting Machine/Wire Saw 'CS-203'

It is also possible to cut large samples measuring 125mm × 125mm! A diamond wire cutting machine/wire saw that supports dry cutting.

The CS-203 is a diamond wire cutting machine capable of both wet and dry cutting. It allows for adjustment of the cutting position, image storage, and real-time display using a CCD camera, and it can perform cutting with minimal impact on various materials, from thin-walled tubes to semiconductors and gemstones, resulting in reduced burrs and chipping. We propose various fixtures for securing samples tailored to our customers' needs. 【Features】 ■ Capable of both wet and dry cutting ■ Adjustment of cutting position, image storage, and real-time display using a CCD camera ■ Cutting with minimal burrs and chipping on various materials ■ Can cut large samples up to 125mm x 125mm (maximum) ■ Proposals for various sample fixtures tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.

  • Plastic processing machines (cutting and rolling)

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MH100 Tabletop Diamond Wire Saw

Compact and space-saving tabletop diamond wire saw for laboratory use, easy-to-handle single wire type.

It is ideal for research and development purposes.

  • Other processing machines

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MH-1000 Multi-Wire Saw

● Down-cutting method using diamond wire ● No slurry required due to fixed abrasives ● Compatible with wafer processing of small diameters up to 4 inches

- Compatible with wafer processing of small diameters up to 4 inches - Down-cut method using high-performance electroplated diamond wire - No slurry required due to fixed abrasives - Capable of processing various materials by changing wire speed - Square cutting is also possible - High-precision processing of all hard and brittle materials is possible

  • Other processing machines

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